TLDR:
- Samsung is turning to the same AI chipmaking technology as its rival SK Hynix to catch up in the AI race.
- Samsung has purchased chipmaking technology to support the mass reflow molded underfill (MR-MUF) method.
Samsung Electronics is reportedly adopting the chipmaking technology championed by its rival SK Hynix in order to develop advanced AI chips. While Samsung has historically used non-conductive film (NCF) chipmaking technology, it has faced production issues and lagged behind its competitors. SK Hynix, on the other hand, has had success with the mass reflow molded underfill (MR-MUF) chipmaking method, leading to higher production yields.
Although Samsung has denied rumors that it will apply MR-MUF to its HBM production, sources have confirmed that the company has acquired chipmaking technology to support the MR-MUF method. At the same time, both Samsung and SK Hynix have halted the sale of used chipmaking equipment on the secondary market, storing it in warehouses to avoid breaching U.S. export controls and sanctions on China and Russia.
Overall, Samsung’s adoption of rival technology and strategic moves in the chipmaking industry indicate its efforts to compete in the AI race and enhance its position in the market.